and Description of the Isthmus of America , LionelWafer. Edited by L.E. Elliott Joyce Oxford Hakluyt ... , by Cindy Vallar, about LionelWafer s and William Dampier s common adventures. External links cite DNB wstitle Wafer, Lionel Persondata Metadata see Wikipedia Persondata . NAME Wafer, Lionel ALTERNATIVE ... Wafer, Lionel Category 1640 births Category 1705 deaths Category 17th century explorers Category Privateers Category Explorers of Central America Category Welsh explorers fr LionelWafer uk ... more details
for semiconductor wafers Wafer electronics stack Image Wafers.jpg thumb Israeli chocolate cream flavored wafers Image Oplatki.w.koszyczku.jpg thumb Polish Christmas wafers Image Karlsbader Oblate.jpg thumb Carlsbad spa wafer In cooking, a wafer also spelled waffer is a crisp, often sweet, very thin, flat, and dry biscuit, often used to decorate ice cream . Wafers can also be made into cookies with cream flavoring sandwiched between them. They frequently have a waffle surface pattern but may also be patterned with insignia of the food s manufacturer or may be patternless. Many chocolate bars, such as Kit Kat and Coffee Crisp , have wafers in them. Communion wafer The word also refers to the special small round, often starchy flatbread s made for Latin liturgical rites Western Rite celebrations of the Eucharist , including Roman Catholic , Anglican , Lutheran and some of the more liturgical Protestant churches. The word Host Holy Communion host is used to describe the larger wafer used by the clergy , while the term communion wafer refers to the smaller pieces used to distribute Holy Communion to the people. These holy wafers often have an image of a Christian cross cross or the crucified Christ imprinted on them. Spa wafers Special spa wafers Czech l ze sk oplatky , Slovak k pe n opl tky are produced in the spa towns of the Czech Republic e.g. Karlovy Vary , Mari nsk L zn , etc. and the Slovak Republic e.g. Pie any , etc. . Christmas wafer Christmas wafer s, whose patterns often depict religious scenes, are an Eastern Europe an Roman Catholic Christmas tradition celebrated in Poland Polish , Slovakia Slovak , Lithuania n and Italy Italian families during Wigilia Christmas Eve Vigil . Oblea A variation of wafer is considered a part of the traditional cuisine in Colombia ... popular as they are very inexpensive. Freska Freska is an Egyptian wafer sold only on beaches in the summertime ... stub bg de Oblate Geb ck es Oblea fa fr Oublie he io Obleo it Wafer biscotto ja ... more details
Wafer Weafer , Weaver is an English surname, and may refer to Jeremy Wafer 1952 , South African Artist Ken Weafer 1913 2005 , American baseball player and second cousin of Jeremy Wafer. Von Wafer 1985 , American Basketball player See also Weaver disambiguation , an English variant Wever disambiguation , a Dutch variant Weber , a German variant Webber surname , an English variant Category Surnames de Wafer fr Wafer ... more details
Jeremy Wafer born 1953 is a South Africa n sculptor and printmaker. ref Philippa Hobbs, Elizabeth Rankin, Printmaking In a Transforming South Africa , New Africa Books, 1997, p80. ISBN 0864863349 ref Early life Born in Durban , to Laura, a nurse, and Michael Mick Wafer, a World War II naval pensioner from Aghada , Co. Cork , Ireland , Wafer grew up on a farm with his brothers Patrick & Timothy before earning his undergraduate degree in fine arts from the University of Natal, Pietermaritzburg in 1979 in 1987 he received a master s degree in fine arts from the University of Witwatersrand . He was at one time head of the Department of Fine Arts at the Natal Technikon. Currently he resides in Johannesburg and heads the Department of Fine Art at the University of Witwatersrand . He co designed the Wall of Hope AIDS monument with Georgia Sarkin , dedicated to the memory of Gugu Dlamini , in Durban , South Africa. ref Annie E. Coombes, History After Apartheid , Duke University Press, 2003, p112. ISBN 0822330725 ref Wafer has two children, Mary & Alexander WaferWafer s uncle, Richard Wafer, died on the HMS Jaguar F34 trying to rescue his comrades. Wafer is also second cousin once removed to the baseball player, Ken Weafer & is third cousin to Richard B. Fitzgibbon, Jr. . His work is held in the National Museum of African Art of the Smithsonian Institution, Washington D.C. ref http africa.si.edu collections rsdadvnNav.asp?BrowseMode 3&offset 0 africa.si.edu ref References Reflist External links http africa.si.edu exhibits insights wafer artist.html Bio from the National Museum of African Art Persondata Metadata see Wikipedia Persondata . NAME Wafer, Jeremy ALTERNATIVE NAMES SHORT DESCRIPTION DATE OF BIRTH 1953 PLACE OF BIRTH DATE OF DEATH PLACE OF DEATH DEFAULTSORT Wafer, Jeremy Category 1953 births Category Living people Category South African sculptors Africa sculptor stub SouthAfrica artist stub ... more details
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow for stacking and high density packaging of integrated circuits IC . ICs are being produced on semiconductor Wafer electronics wafers that undergo a multitude of processing steps. The silicon wafers predominantly being used today have diameters of 20 and 30 cm. They are roughly 750 micrometre m thick to ensure a minimum of mechanical stability and to avoid warping during high temperature processing steps. Smartcards, USB memory sticks, smartphones, handheld music players, and other ultra compact electronic products would not be feasible in their present form without minimizing the size of their various components along all dimensions. The backside of the wafers are thus ground prior to wafer dicing where the individual microchips are being singulated . Wafers thinned down to 75 to 50 m are common today. ref name itrs09 http www.itrs.net International Technology Roadmap for Semiconductors 2009 edition, page 12 53. ref The process is also known as Backlap ref name an900 http www.st.com stonline books pdf docs 5038.pdf Introduction to Semiconductor Technology , by ST Micro electronics, page 6. ref or Wafer thinning . ref name sfe http www.siliconfareast.com backgrind.htm Wafer Backgrind at Silicon Far East. ref See also Back illuminated sensor References references Category Semiconductor device fabrication ... more details
merge to Wafer electronics date October 2010 refimprove date December 2007 Wafer dicing is the process by which Die integrated circuit die are separated from a Wafer electronics wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing normally with a machine called a dicing saw or by laser cutting . Following the dicing process the individual silicon Integrated circuit chips are encapsulated into chip carrier s which are then suitable for use in building Electronics electronic devices such as computer s, etc. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Once a wafer has been diced, the pieces left on the dicing ... die streets which are typically about 75 micrometres 0.003 inch wide. Once a wafer has been ... Delicate compound semiconductors Stealth dicing Image Stealth diced Si wafer 150 m 430x400 MB11.png right thumb Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 ... JOAM2010.pdf ref Dicing of wafer electronics silicon wafers may also be performed by a laser ... defect regions are firstly introduced into the wafer by scanning the beam along intended cutting lines ... of the laser along the intended dicing lanes, where the beam is focused at different depths of the wafer ... and K. Fukumitsu title Advanced Dicing Technology for Semiconductor Wafer Stealth Dicing journal ..., while the wafer is moved with a velocity of about 1 m s. A defected region of about 10 m width is finally inscribed in the wafer, along which preferential fracture occurs under stress mechanics ... the carrier membrane to which the wafer is attached. The cleavage initiates at the bottom and advances ... exploitation of the wafer surface due to smaller kerf loss compared to wafer sawing. See also Wafer bonding References reflist DEFAULTSORT Wafer Dicing Category Semiconductor device fabrication ... more details
Wafer testing is a step performed during Fabrication semiconductor semiconductor device fabrication . During this step, performed before a wafer is sent to die preparation , all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them. The wafer testing is performed by a piece of test equipment called a wafer prober . The process of wafer testing can be referred to in several ways Wafer Sort WS , Wafer Final Test WFT , Electronic Die Sort EDS and Circuit Probe CP are probably the most common. ref citeweb title Silicon Wafer Technology url http www.maviye.com comments.asp?id 67 accessdate 2008 02 23 ref Wafer prober File Wafer prober service configuration.jpg thumb right 350px 8 inch semiconductor wafer prober, shown with cover panels, tester and probe card elements removed. A wafer prober is a machine used to test ... card are held in place whilst the wafer, vacuum mounted on a wafer chuck, is moved into electrical contact. When a die or array of dice have been electrically tested the prober moves the wafer to the next die or array and the next test can start. The wafer prober is usually responsible for loading ... optics capable of aligning the wafer with sufficient accuracy to ensure accurate registration between the contact pad s on the wafer and the tips of the probes. For today s multi die packages ... overall system yield. The wafer prober also exercises any test circuitry on the wafer scribe lines ... that wafer testing is an unnecessary, redundant step. In reality this is not usually the case, since ... the production yield is so high that wafer testing is more expensive than the packaging cost of defect devices, the wafer testing step can be skipped altogether and dies will undergo blind assembly ... by Ashok K. Sharma Hardcover Sep 9, 2002 See also Wafer prober Non contact wafer testing Wafer bonding Bond characterization References Reflist DEFAULTSORT Wafer Testing Category Semiconductor ... more details
Infobox NBA biography name Von Wafer image Von Wafer Celtics.jpg width caption Wafer right with the Celtics ... Magic Vakeaton Quamar Wafer born on July 21, 1985 in Homer, Louisiana , commonly referred to as Von Wafer , is an United States American professional basketball player for the Orlando Magic . He has ... school Wafer attended Pineview High School in Lisbon, Louisiana during his freshman, sophomore and junior .... Up to that point, Wafer was a virtual unknown on the national recruiting scene. Tim Loring, the coach of the Arkansas Wings Amateur Athletic Union AAU team, invited Wafer to play for them the summer before his senior year. This allowed Wafer to display his skills on a wider stage, and by the end ..., 8 rebounds, 4 steals, and 4 blocks per game. Wafer was the seventh McDonald s High School All American ... year at Florida State University in the 2003 04 season, Wafer averaged 7.9 points in 17.5 minutes ... ref Professional career Wafer declared himself as an early entry candidate for the 2005 NBA Draft ... several hurdles he had to overcome to become a viable option for an NBA team to select him. Wafer ... a workout with the Phoenix Suns , Wafer reportedly was frustrated by the physical play from Jan Jagla ...?playerId 18821 title Von Wafer Draft Bio publisher ESPN.com Insider date accessdate 2010 12 29 ref ref ... a workout for Wafer with the Lakers. ref http www.tallahassee.com mld tallahassee sports colleges ... Kupchak saw enough of Wafer s ability that they used the second of their two second round picks to select Wafer in the draft. Wafer was placed on waivers by the Lakers on October 26, 2006. He played ... ref Wafer then played for the Colorado 14ers of the NBA Development League during 2006 07, and was named ... Colorado Guard Von Wafer D League Player of Month , February 2, 2007 ref He was signed to a ten day contract by the Los Angeles Clippers on February 21. ref http www.insidehoops.com wafer clippers 022107.shtml Clippers sign Von Wafer ref He played one minute ref name rockymountainnews http www.rockymountainnews.com ... more details
merge from Wafer dicing date October 2010 File Siliziumwafer.JPG thumb 250px Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation see below Image ICC 2008 Poland Silicon Wafer 1 edit.png thumb 250px VLSI microcircuits fabricated on a convert 12 in mm adj on silicon wafer, before wafer dicing dicing and Integrated circuit packaging packaging In electronics , a wafer is a thin slice of semiconductor material , such as a Monocrystalline ... and other microdevices. The wafer serves as the substrate semiconductor substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping ... the individual microcircuits are separated wafer dicing dicing and Integrated circuit packaging packaged . Several types of solar cell are also made from such wafers. On a solar wafer a solar cell usually square is made from the entire wafer. Formation See also Ingot Image Czochralski Process.svg thumb right 350px The Czochralski process . Image Wafer 2 Zoll bis 8 Zoll 2.jpg thumb right 200px convert ... p type extrinsic silicon. The ingot is then wikt sliced sliced with a wafer saw wire saw and polishing ... books?id Qi98H iTgLEC&pg PA70&dq wafer flat and notch PPA71,M1 accessdate 2008 02 25 ref .... In the future, 160 m will be the standard. ref http www.omron semi pv.eu en wafer based pv wafer preparation slicing the ingot.html ref Electronics use wafer sizes from 100 300 mm diameter. The largest wafer made has a diameter of 450 mm but is not in production yet. Cleaning, texturing ... of the wafer in the etching . ref http www.omron semi pv.eu en wafer based pv front end wet process.html ref Wafer properties Standard wafer sizes Silicon wafers are available in a variety of sizes from 25.4 mm 1 inch to 300 mm 11.8 inches . ref Cite web title Silicon Wafer url ...?articleID 211300360&pgno 1 Industry Agrees on first 450 mm wafer standard EETimes.com , retrieved ... more details
citations missing date December 2008 Image Oplatki.w.koszyczku.jpg thumb right Christmas wafer Christmas wafer lang pl op atek , plural lang pl op atki lang lt kal daitis is a Central Europe central European Christianity Christian Christmas tradition celebrated in Poland , Lithuania and Slovakia during Wigilia , or the Christmas Eve Vigil. The flatbread unleavened wafers are baked from pure wheat flour and water , are usually rectangular in shape and very thin they are identical in composition to a round wafer which become the Host Holy Communion Host after the Consecration during Mass in the Roman Catholic Church . Being only a reminder of the Body of Christ used in private homes, Op atki lack sanctification by a priest or bishop . The Op atki wafers are embossed with Christmas related religious images, varying from the nativity scene , especially Virgin Mary with baby Jesus , to the Star of Bethlehem . Poland unreferenced section date January 2010 Family members and friends break off a small piece of the op atek wafer and give it to one another along with a blessing . Breaking off and exchanging ... the only coloured wafer to the farm animals. This tradition is sometimes maintained in the countryside. The tradition of sharing the Op atek, or christmas wafer is one of the rich variety of traditions ... of the family is given a piece of unleavened wafer. The head of the family, typically the oldest person present however often father of the family, then takes a wafer and offers it to a family member ... and break off a piece of wafer. The family member then offers the head of the family a piece of their wafer in return. The head of the family then offers their wafer to every family member or guest at the table. After them, all the diners exchange greetings and morsels of wafer. Care is taken not to skip ... of wafer, each tries to get a piece larger than that remaining in the other s hand for it means his year will be better. The person holding the wafer tries to prevent a large piece being taken for this will break ... more details
Infobox NFL player name Carl Wafer currentposition Defensive end currentnumber 72, 78 birth date birth date and age 1951 1 17 birth place Magnolia, Arkansas deathdate deathplace heightft 6 heightin 4 weight 250 college Tennessee State University Tennessee State debutyear 1974 debutteam New York Giants finalteam Green Bay Packers finalyear 1974 draftyear 1974 draftround 2 draftpick 42 pastteams nowiki nowiki New York Giants 1974 NFL season 1974 Green Bay Packers 1974 statseason 1974 statlabel1 Games played statvalue1 3 nfl WAF415291 Carl Wafer is a former defensive end in the National Football League . He was drafted in the second round of the 1974 NFL Draft by the Denver Broncos and would split that season between the New York Giants and the Green Bay Packers . ref cite web url http www.pro football reference.com players W WafeCa20.htm title Carl Wafer publisher Pro Football Reference.com accessdate 2010 12 26 ref References reflist Persondata Metadata see Wikipedia Persondata . NAME Wafer, Carl ALTERNATIVE NAMES SHORT DESCRIPTION American football player DATE OF BIRTH 1951 01 17 PLACE OF BIRTH Magnolia, Arkansas DATE OF DEATH PLACE OF DEATH DEFAULTSORT Wafer, Carl Category People from Columbia County, Arkansas Category New York Giants players Category Green Bay Packers players Category American football defensive ends Category Tennessee State Tigers football players Category 1951 births Category Living people defensive lineman 1950s stub ... more details
Image Neapolitaner Waffel 2.jpg thumb right 200px Neapolitan wafers Neapolitan wafers are a wafer and chocolate cream sandwich biscuit , first made by Austria n company Manner in 1898. ref name manner http www.manner.com en index.php?idp 78&lang 1 Q&A on the official Manner homepage ref Using Hazelnuts imported from Naples , Italy , to make the hazelnut flavoured chocolate cream filling, they have five wafers and four layers of cream in their Convert 49 mm in x convert 17 mm in x convert 17 mm in biscuit size. The basic recipe has remained unchanged to this day. ref name manner Manner still sell the biscuits in blocks of ten, ref name manner although now many other companies have copied the idea, most often coating the bar in chocolate. References reflist Category Austrian cuisine Category Brand name biscuits British style dessert stub de Neapolitaner Waffeln es Napolitana wafer fr Gaufrette it Wafer biscotto hu N polyi ostya ... more details
Wafer bonding is a packaging technology on Wafer electronics wafer level for the fabrication of microelectromechanical systems MEMS , nanoelectromechanical systems NEMS , microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers diameter range from 100 mm to 200 mm 4 inch to 8 inch for MEMS NEMS and up to 300 mm 12 inch for the production of microelectronic devices. Overview In microelectromechanical systems MEMS and nanoelectromechanical systems NEMS , the package is an important part of the device. It enhances a proper function and protects the sensitive internal structures from environmental influences such as temperature, moisture, high pressure and oxidizing species. So, the long term stability and reliability of the functional elements directly depend on the encapsulation process as well as a significant fraction on the overall device costs. ref name Cho2005 In conclusion, the package has to fulfill the following requirements ref name GOWF2005 protection against environmental influences heat dissipation integration of elements with different technologies compatibility to the surrounding periphery maintenance of energy and information flow Techniques The commonly used and developed bonding methods are as follows Direct bonding Plasma activated bonding Anodic bonding Eutectic bonding Glass frit bonding Adhesive bonding Thermocompression bonding Reactive bonding Requirements The bonding of wafers requires specific ... ref name GOWF2005 cite conference author T. Gessner and T. Otto and M. Wiemer and J. Fr mel title Wafer ... reichl tagungsband wafer level integration 206gessner.jsp ref ref name Cho2005 cite article author ... 1095219.1095227 issue 11 ref ref name PK1999 cite article author A. Pl ssl and G. Kr uter title Wafer ... EN abteilungen mdi forschung advanced technologies Waferbonden index.jsp Wafer bonding at Fraunhofer ... 3 527 32646 4 ?sID p2qlnooj68su7htl8qrrc2qjt3 Handbook of Wafer Bonding, Wiley VCH, edited by Peter ... more details
orphan date February 2010 Bremner Wafers are made by the Bremner Biscuit Company . The company claims that the Cracker food crackers have a neutral taste and that they are perfect for pairing with fine wine or savoring with cheese and pat or seafood , soups and salads ref Cite web url http www.worldpantry.com cgi bin ncommerce3 ExecMacro bremner allproducts.d2w report accessdate December 28, 2009 title Bremmer Biscuit Company Our Products work Bremner Biscuit Company publisher WorldPantry.com ref . It is because of this neutral taste that many wineries and food aficionados around the world prefer using the Bremner wafer as a wine tasting cracker. This neutral taste, however is seen as a drawback by some because it means the crackers are nearly tasteless when eaten alone. History The Bremner Biscuit company was founded by David F. Bremner , who first introduced his brands of bread to the fire victims of the great fire in Chicago . Although the Bremmer Wafer wasn t invented until 1902, David Bremner s company was modestly successful prior to its invention. When his sons took over the business When date February 2011 they developed the Bremmer Wafer, which is still sold today. The company remained in Chicago until 1984, when they moved to Denver , where it remains today. The Bremner Biscut Company was bought by Dare Foods in September 1999. Although he is no longer the CEO, Neil Bremner 5th generation runs Dare s baking division. Flavors As of February 5, 2006, there are 8 variations of the original Bremner Wafer Original Wafers suitable for fine wines as described above Sesame Wafers an excellent complement to cheese, pate, smoked fish or any spread ref Cite web url http www.worldpantry.com cgi bin ncommerce3 ProductDisplay?prrfnbr 77341&prmenbr 72038 accessdate December 28, 2009 title Bremmer Biscuit Company Products Sesame Wafers work Bremner Biscuit Company publisher WorldPantry.com ref Cracked Wheat Wafers for topping and spreads Low Sodium Wafers Caraway Wafers ... more details
wiktionary LionelLionel may refer to as a male given name Lionel Atwill , English actor Lionel Barrymore , American actor Lionel Bart , British composer Lionel Blair , British dancer and actor Lionel Hampton , American jazz musician Lionel Jeffries , English actor Lionel Jospin , French politician Lionel Messi , Argentine footballer Lionel Richie , American singer Lionel Rose , Australian boxer Lionel Stander , American actor Lionel Shriver , female American author Lionel Trilling , American literary critic other Lionel Corporation , an American manufacturer and retailer of toy trains and model railroads Lionel Logue , Australian speech therapist and friend of King George VI Lionel, LLC , an American designer and importer of toy trains and model railroads, owns the trademarks and most of the product rights associated with Lionel Corp., but is not directly related Lionel bridge , a bridge defense against 1NT Lionel radio personality , an American radio talk show host Sir Lionel , a knight of the Round Table in Arthurian legend as a placename Lionel, Lewis in the Outer Hebrides of Scotland See also For people and characters with the given name Lionel, see Lookfrom Lionel disambig given name fr Lionel ko it Lionel ja pt Lionel ... more details
Wafer level packaging WLP is the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package CSP technology, since the resulting package is practically of the same size as the die. ref name Semiconductor International http www.semiconductor.net article 197871 Tessera Working WLP Wafer Level Optics.php Tessera Working WLP, Wafer Level Optics , Semiconductor International , April 1 2009 . ref . Wafer level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. Wafer level packaging basically consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging does wafer dicing first, and then puts the individual die in a plastic package and attaches the solder bumps. Wafer level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuit while still in the wafer, and then wafer dicing . There is no single industry standard method of wafer level packaging at present. References reflist External links cite web date 2009 06 16 url http eetimes.eu showArticle.jhtml?articleID 217900029 title Nemotek starts wafer level packaging in Morocco publisher EE Times Europe accessdate 2009 06 16 http www.siliconfareast.com wl package.htm Wafer Level Packaging &ndash From SiliconFarEast.com See also Chip scale package wafer scale integration Wafer bonding Category Chip carriers Category Electronics manufacturing Category Semiconductor technology it Wafer level packaging ja CSP ... more details
Refimprove date February 2008 A wafer tumbler lock is a type of locksmithing lock that uses a set of flat wafers to prevent the lock from opening unless the correct key is inserted. This type of lock is similar to the pin tumbler lock and works on a similar principle. However, unlike the pin tumbler lock, the wafer is a single piece. The wafer tumbler lock is often incorrectly referred to as a disc tumbler lock , which uses an entirely different mechanism. Image Disc tumbler locked.png thumbnail Without a key in the lock, the wafers red are pushed down by springs. The wafers nestle into a groove in the lower part of the outer cylinder green preventing the plug yellow from rotating. Image Disc ... yellow can rotate. Design In a cylinder lock cylindrical wafer tumbler lock, a series of flat .... A rectangular hole is cut into the center of each wafer the vertical position of the holes in the wafers vary, so a key must have notches corresponding to the height of the hole in each wafer, so that each wafer is pulled in to the point where the wafer edges are flush with the plug, clearing the way for the plug to rotate in order to open the lock. If any wafer is insufficiently raised, or raised too high, the wafer edge will be in one of the grooves, blocking rotation. Types and wafer arrangements Wafer tumbler lock configurations vary with manufacturer. The most common is the single bitted, five wafer configuration most commonly found on desk and cabinet locks and some key switches. The illustrations represent this type. Some wafer tumbler locks use a stack of closely spaced wafers ... s contour gauge. Wafer tumbler locks can use single bitted or double bitted keys. Though wafer arrangements ... sets, requiring a double bitted key, the operating principle remains the same. Crushable wafer tumbler lock At one time, several manufacturers made a crushable wafer tumbler ref cite book last first ... External links http www.lockpickguide.com waferlocks.html How to pick wafer locks Category Locks ... more details
Afd merge to Microlens Wafer level optics 03 July 2011 date July 2011 Wafer level optics WLO enables the design and manufacture of miniaturized optics at the wafer level using advanced semiconductor like techniques. The end product is cost effective, miniaturized optics that enable the reduced form factor of camera modules for mobile devices . ref name Photonics.com http www.photonics.com Content ReadArticle.aspx?ArticleID 30459 Wafer Level Camera Technologies Shrink Camera Phone Handsets , Photonics.com , August 2007 . ref . The technology is scalable from a single element CIF VGA lens to a multi element mega pixel lens structure, where the lens wafers are precision aligned, bonded together and diced to form multi element lens stacks. As of 2009 the technology was used in about 10 percent of the mobile phone camera lens market. ref http www.eetimes.com electronics news 4085045 Will Tessera s smart module gamble pay off ?pageNumber 3 ref References reflist Further reading Yehudit Dagan, http spie.org x648.html?product id 811609 Wafer level optics enables low cost camera phones , SPIE Proceedings 2009. Use dmy dates date July 2011 DEFAULTSORT Wafer Level Optics Category Chip carriers Category Electronics manufacturing Category Semiconductor technology ... more details
Wafer scale integration , WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire wafer electronics silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputer s. The name is taken from the term very large scale integration , the current state of the art when WSI was being developed. The concept To understand WSI, one has to consider the normal chip making process. A single large cylindrical crystal ... where material ought to be deposited on top of the wafer and where not to. The desired material is deposited and the photographic mask is removed for the next layer. From then on the wafer is repeatedly ... copies of these patterns are deposited on the wafer in a grid fashion across the surface of the wafer. After all the possible locations are patterned, the wafer surface appears like a sheet of graph ... and marked with a dot of paint. The wafer is then sawed apart to cut out the individual chips ... for the entire cost of the wafer and its processing, including those discarded defective chips ... of working chips can be obtained per wafer. The vast majority of the cost of fabrication typically ... the chips into an integrated system usually via a printed circuit board . Wafer scale integration ... package &ndash in principle, chips as large as a full wafer. Of course this is not easy, since given the flaws on the wafers a single large design printed onto a wafer would almost always not work ..., as opposed to sawing them out of the wafer. Generally, this approach uses a grid pattern of sub circuits and rewires around the damaged areas using appropriate logic. If the resulting wafer has enough ... Elxsi. See also wafer level Packaging Category Semiconductor device fabrication ms Penyepaduan skala wafer ... more details
Wafer testing is a normal step in semiconductor device fabrication , used to detect defects in integrated circuits IC before they are assembled during the IC packaging step. Traditional contact wafer testing Probing ICs while they are still on the wafer normally requires that contact be made between the automatic test equipment ATE and IC. This contact is usually made with some form of mechanical probe. A set of mechanical probes will often be arranged together on a probe card, which is attached to the wafer prober. The wafer is lifted by the wafer prober until metal pads on one or more ICs on the wafer make physical contact with the probes. A certain amount of over travel is required after the first probe makes contact with the wafer, for two reasons to guarantee that all probes have made contact to account for non planarity of the wafer li to break through the thin oxidized layer if the metal pad is Aluminum on the pad li There are numerous types of mechanical probes available commercially their shape can be in the form of a cantilever , spring device spring , or membrane, and they can be bent into shape, stamped, or made by Microelectromechanical systems processing. Using mechanical probes has certain drawbacks mechanical probing can damage the circuits under the probe pad on the IC ref cite web title Test & Measurement World work Probe mark inspection url http www.tmworld.com article CA6436545.html ref li repeated probing can http images.pennnet.com articles sst thm th 0707sstprocess01.jpg ... with the wafer ref cite web title Test & Measurement World work Investigation Conquers Probe Card ... the results of the test. For this reason, the tests performed at wafer sort cannot always be identical ... web title StatsChipPac work Wafer Sort url http www.statschippac.com services testservices wafersort.aspx ... Non contact wireless wafer testing Alternatives to mechanical probing of ICs have been explored ... data rates are possible than with mechanical probes li the wafer prober does not have to exert any ... more details
Multi Project Chip MPC or Multi Project Wafer MPW services integrate onto microelectronics wafers a number of different integrated circuit designs from various teams including designs from private firms, students and researchers from universities. Because IC fabrication costs are extremely high, it makes sense to share mask and wafer resources to produce designs in low quantities. Worldwide, several MPW services are available from government supported institutions or from private firms including MOSIS, CMP and Europractice. The first well known MPW service was MOSIS Metal Oxide Silicon Implementation Service , established by DARPA as a technical and human infrastructure for VLSI . MOSIS began in 1981 after Lynn Conway organized the first VLSI System Design Course at M.I.T. in 1978. MOSIS primarily services commercial users now but continues to serve university students and researchers. With MOSIS, designs are submitted for fabrication using either open i. e., non proprietary VLSI Design rule checking layout design rules or vendor proprietary rules. Designs are pooled into common lots and run through the fabrication process at foundries. The completed chips packaged or unpackaged are returned to customers. Many silicon fabrication facilities offer MPW runs or a company can produce its own MPW, e.g. combine several of its own designs to form one wafer completely owned by the company. In the latter case, it may be profitable to use most of the wafer for production chips and a small portion for producing prototypes of next generation chips. References http ai.eecs.umich.edu people conway VLSI MIT78 MIT78.html The M.I.T. 1978 VLSI System Design Course Category Electronic design automation Category Electronic engineering Category Semiconductor device fabrication ru Multi Project Wafer ... more details
Infobox State Senator name Thomas Wafer Fuller image Thomas Wafer Fuller.jpg image size 225px caption Early photograph of Louisiana State Senator Thomas W. Fuller office Louisiana State Legislature Louisiana State Senator from Bienville, Bossier and Webster parishes term start 1896 term end 1900 preceded G. L. P. Wren br W. L. Stroud succeeded E. S. Dortch office2 Superintendent of Webster Parish, Louisiana Webster Parish Schools term start2 1908 term end2 1920 preceded2 John M. Davies succeeded2 Edwin Richardson Edwin Sanders Richardson birth date birth date mf yes 1867 5 28 birth place Minden, Louisiana Minden , Webster Parish death date death date and age mf yes 1920 12 20 1867 5 28 death place Minden, Louisiana spouse Alma Bright Fuller married 1891 1920, his death children Lee Aura Fuller ... br Margaret Wafer Fuller party Democratic Party United States Democratic occupation Educator br Newspaper ... on the National Register of Historic Places . Image Gravestone of Thomas Wafer Fuller IMG 4990.JPG ... Thomas Wafer Fuller May 28, 1867 December 20, 1920 was an educator and newspaperman from Minden, Louisiana ... I04178&tree T1&PHPSESSID 982617e081612c007291090fb2ba0cff title Thomas Wafer Fuller publisher ... Margaret A. Wafer 1832 1880 of then Claiborne Parish, Louisiana Claiborne Parish , from which Webster Parish was severed in 1871. ref cite web url http genforum.genealogy.com wafer messages 113.html title Mabry Wafer Louisiana publisher genforum.genealogy.com accessdate August 20, 2011 ref Margaret ... Wafer Fuller are interred in the former Fuller Memorial Shrine Cemetery behind West Union Street ... State Senator from Bossier, Bienville, and Webster parishes Thomas Wafer Fuller years 1896&ndash 1900 ... School Superintendent Thomas Wafer Fuller years 1908&ndash 1920 after Edwin Richardson Edwin Sanders Richardson end box Persondata Metadata see Wikipedia Persondata . NAME Fuller, Thomas Wafer ALTERNATIVE ... PLACE OF DEATH Minden, Louisiana DEFAULTSORT Fuller, Thomas Wafer Category 1867 births Category 1920 ... more details
Taxobox name Wafer trapdoor spiders image Aptostichus sp. Marshal Hedin .jpg image caption Aptostichus sp. image width 240px regnum Animal ia phylum Arthropod a classis Arachnid a ordo Spider Araneae subordo Mygalomorphae infraordo Fornicephalae superfamilia Cyrtauchenioidea familia Cyrtaucheniidae familia authority Eug ne Simon Simon , 1892 diversity link List of Cyrtaucheniidae species diversity 18 genera, 126 species range map Distribution.cyrtaucheniidae.1.png range map width 250px subdivision ranks Genera subdivision Aptostichus br Myrmekiaphila br Promyrmekiaphila br others, see text The wafer trapdoor spiders superfamily Cyrtauchenioidea , ref Raven, R.J. 1985. The spider Infraorder Mygalomorphae Araneae cladistics and systematics. Bulletin of the American Museum of Natural History 182 1 180. ref family Cyrtaucheniidae are a widespread family of spider s that lack the thorn like spines on tarsal tarsi and metatarsal metatarsi I and II the two outermost leg segments found in true trapdoor spider s Ctenizidae . br clear left Biology Many, but not all, make wafer like doors to their burrows, while others build the cork like doors found commonly in the true trapdoor spiders. The biology of nearly all the species is poorly known. The monotypic Angka hexops has only six eyes, with the posterior median eyes missing. It is up to 15 mm long in both sexes. ref Murphy & Murphy 2000 ref Distribution The family is well represented in the United States , Mexico , South America , and Africa . Common U.S. genus genera include Myrmekiaphila , Aptosticus and Promyrmekiaphila . A currently undescribed genus in the western United States may hold an altitude record for the family, being found up to over 11,000 feet 3,300 meters . The genus Anemesia is found only in Central Asia , and Cyrtauchenius reaches from Algeria north to Italy, with one species found in the USA. Angka is endemic ... Cyrtaucheniidae Araneae DEFAULTSORT Wafer Trapdoor Spider Category Cyrtaucheniidae ca Cirtauqu nid ... more details
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