wiktionary Etch may refer to Etch protocol an open source, cross platform, multi language framework for building network services released by Cisco Systems into the Apache Software Foundation Etch Toy Story Etch , a character from the film Toy Story , based on the Etch A Sketch Etch, the codename for Debian GNU Linux 4.0 itself named after the Toy Story character See also Etching disambiguation disambig bar Etch de Etch ... more details
Etch is an open source , cross platform framework for building network services, first announced ref name announce cio http www.cio.com article 365513 Cisco Systems New Client Server Messaging Protocol Announced , CIO Magazine , May 22, 2008 ref in May 2008 by Cisco Systems . Etch encompasses a service description language, a compiler, and a number of language bindings. It is intended to supplement SOAP and CORBA as methods of communicating between networked pieces of software, especially where there is an emphasis on portability, transport independence, small size, and high performance. Etch is designed to be easily incorporated into existing applications and systems, enabling a natural and easy transition to a service oriented architecture . It originally was derived from work on the http developer.cisco.com web cuae home Cisco Unified Application Environment , the product acquired by Cisco as part of the Metreos acquisition. Implementations The initial release will support Java programming language Java and C Sharp programming language C . A second wave of support will include Ruby programming language Ruby , Python programming language Python , Javascript , and C programming language C . Open sourcing and licensing In July 2008, Etch was released under the Apache 2.0 license. ref name license http developer.cisco.com web cuae etch What is Etch? ref As part of the open source process, Etch was submitted to the Apache Incubator to be accepted as a new podling ref name apache proposal http wiki.apache.org incubator EtchProposal Proposal to accept Etch into the Apache Incubator ... search ?q etch 20vote 20apache 20incubator query etch 20vote 20apache 20incubator page 1 mid 6fusg5jtsqbcgpr7 state results Apache Incubator vote thread ref and was eventually passed. Etch is now ... cwiki.apache.org ETCH http www.cisco.com en US netsol ns738 networking solutions package.html Cisco ... protocols fr Etch protocole ... more details
Infobox Toy name Etch A Sketch image Image EtchASketch10 23 2004.jpg 200px type Drawing toy inventor ... a sketch.com slogan Etch A Sketch is a registered trademark for a mechanical drawing toy manufactured by the Ohio Art Company . An Etch A Sketch is a thick, flat gray screen in a plastic frame ... moves it vertically. The Etch A Sketch was introduced near the peak of the post World War II baby boom ... named Etch A Sketch to its Century of Toys List, a roll call commemorating the 100 most memorable .... fact date November 2011 Mechanics Image EtchASketchPc190022.jpg thumb Etch A Sketch with inside shown ... Please see discussion for changes that need to be made in this section The Etch A Sketch toy ... howaboutthat 7885062 Etch A Sketch turns 50 amazing art created with the drawing toy.html accessdate 13 July 2010 newspaper Telegraph date July 12, 2010 location London title Etch A Sketch ... is 50 Etch A Sketch has carved a spot of honor in pop culture url http www.tradingmarkets.com news stock alert oart icon of childhood is 50 etch a sketch has carved a spot of honor in pop culture ... Ecran Magique was soon renamed the Etch A Sketch and became the most popular drawing toy in the business ... States in time for the 1960 holiday season with the name Etch A Sketch . Ohio Art supported the toy ... title ref Etch a Sketch was manufactured in Bryan, Ohio until the company moved the manufacturing ... December 7, 2003 ref Later versions Etch A Sketch Animator Image Etch A Sketch Animator.jpg 150px right thumb The Etch A Sketch Animator The Etch A Sketch Animator, which debuted in 1986, ref name Funding ... Etch A Sketch, with several buttons to manipulate the drawings. It had a few kilobyte s of memory ..., which made static like sounds when the knobs were moved and during animations. Etch A Sketch Animator 2000 Unsourced image removed Image oaetch2000.jpg 150px right thumb The Etch A Sketch Animator 2000 The Etch A Sketch Animator 2000 was a portable toy developed by Ohio Art in 1987, debuting in 1988 ... more details
orphan date August 2010 The Wright Etch is a preferential etch for revealing defects in 100 and 111 oriented, p and n type silicon . It was developed by Margaret Wright Jenkins in 1976 while working in research and development at Motorola Inc. It was published in 1977 ref Margaret Wright Jenkins, Journal of the Electrochemical Society 124 , 757 759, 1977 ref . This etchant reveals clearly defined oxidation induced stacking faults, dislocations, swirls and striations with minimum surface roughness or extraneous pitting. These defects are known causes of shorts and current leakage in finished semiconductor devices such as transistor s should they fall across isolated junctions. A relatively slow etch rate 1 micrometre per minute at room temperature provides etch control. The long shelf life of this etchant allows the solution to be stored in large quantities. The present report summarizes the highlights of the Wright etch. For a detailed discussion of observation and findings, please consult the original publication ref Margaret Wright Jenkins, Journal of the Electrochemical Society 124 , 757 759, 1977 ref . Etch formula The composition of the Wright etch is as follows 60 ml conc. HF ... the order of mixing is not critical. Etch mechanism The Wright etch consistently produces well defined etch figures of common defects on silicon surfaces. This attribute is attributed to the interactions ... , usually HF. This is a continuous process during the etch cycle. In order to delineate a crystal ... acid which prevents the formation of bubbles during etching. Summary This etch process is a quick ... that Wright etch is superior in revealing stacking faults and dislocation etch figures when compared ... see references for comparison micrographs. This etch is widely used in failure analysis of electrical ... t6 1 2.html . In these publications, by comparison, the Wright etch was the preferred etchant to reveal ... amat def en kap 6 advanced t6 1 2.html DEFAULTSORT Wright Etch Category Etching Category Etching microfabrication ... more details
Mergeto Industrial etching date January 2010 orphan date January 2010 Metallographic Etch Techniques Many Metallographic etches exist for examining the microstructure of steel and related materials. A few very common etchant s and use are listed here. Nital This is a common etch for revealing Grain boundary grain boundaries especially in carbon steel s. It is made through the mixture of Nitric acid Nitric Acid 70 reagent grade and an alcohol which may be ethanol , methanol , or mineral spirits . Methanol is seldom used due to its toxicity and the most common alcohol used is ethanol Note be cautious when mixing always add the acid to alcohol while stirring and never store concentrations of Nital greater than 5 as at 10 it is comparable to rocket fuel in its volatility chemistry volatility . This etchant is relatively simple to use, simply wash the polished specimen in the Nital for a few seconds then rinse with water and ethanol, dry and then the specimen is ready to be examined. For this etchant it is essential that the metal be polished with no imperfections to allow a proper etch. Macroetchants While there are many macroetchants around one technique very commonly used to reveal Dendrite metal dendritic patterns and Segregation in materials segregation impurities in steel is a hydrochloric acid solution. There are a few variations of this etch, but in the simplest form it is a mixture of approximately 38 HCl reagent grade with Distilled water distilled and deionized water at a ratio of 1 1 again, add the acid to the water . This mixture is heated to 70 to 80 degrees celsius and the specimen is immersed in the solution for anywhere between 10 minutes to over an hour depending on the desired result. After the desired time has passed the specimen is rinsed in cool water and desmutted with a vegetable brush and then rinsed in alcohol and dried. The rinse step of this etchant .... DEFAULTSORT Etch Techniques Category Metallurgy ... more details
Unreferenced stub date December 2009 The etch pit density EPD is a measure for the quality of semiconductor wafer s. An Wet etching etch solution is applied on the surface of the wafer where the etch rate is increased at dislocation s of the crystal resulting in wikt pit pits . For GaAs one uses typically molten Potassium hydroxide KOH at 450 degrees Celsius for about 40 minutes in a zirconium crucible . The density of the pits can be determined by Microscopy Light Microscopy the contrast issue optical contrast microscopy . Silicon wafers have usually a very low density of 100 cm sup 2 sup while semi insulating GaAs wafers have a density on the order of 10 sup 5 sup cm sup 2 sup . High purity Semiconductor detector Semiconductor particle detectors Germanium detectors require the Ge crystals to be grown with a controlled range of dislocation density to reduce impurities. The etch pitch density requirement is typically within the range 10 sup 3 sup to 10 sup 4 sup cm sup 2 sup . The etch pit density can be determined according to DIN 50454 1 and ASTM F 1404. DEFAULTSORT Etch Pit Density Category Semiconductors Measurement stub de Versetzungsdichte ko ... more details
Advanced Silicon Etch ASE is a deep reactive ion etching DRIE technique to rapidly etch deep and high aspect ratio structures in silicon. ASE was pioneered by Surface Technology Systems Plc. STS in 1994 in the UK. STS has continued to develop this process with even greater etch rates while maintaining side wall roughness and selectivity. STS developed the switched process originally invented by Dr. Larmer at Bosch, Stuttgart. ASE consists in combining the fast etch rates achieved in an isotropic Si etch usually making use of an SF sub 6 sub Plasma physics plasma with a deposition or passivation process usually utilising a Octafluorocyclobutane C4F8 plasma condensation process by alternating the two process steps. This approach achieves the fastest etch rates whilst maintaining the ability to etch Anisotropy anisotropically , typically vertically in Microelectromechanical Systems Microelectromechanical systems MEMS applications. blockquote The ASE HRM is an evolution of the previous generations of ICP design, now incorporating a decoupled plasma source patent pending . This decoupled source generates very high density plasma which is allowed to diffuse into a separate process chamber. Through careful chamber design, the excess ions that are detrimental to process control are reduced, leaving a uniform distribution of fluorine free radicals at a higher density than that available from the conventional ICP sources. The higher fluorine free radical density facilitates increased etch rates, typically over three times the etch rates achieved with the original Bosch process. Also, as a result of the reduction in the effect of localised depletion of these species, improved uniformity for many applications can be achieved. ref Hopkins et al. 2004 Developments in Si and SiO2 Etching for MEMS based Optical Applications 2004 ref blockquote References reflist Citation last Hopkins first J title Developments in Si and SiO2 Etching for MEMS based Optical Applications 2004 url http ... more details
Buffered oxide etch BOE , also known as buffered HF or BHF, is a wet Etching microfabrication etchant used in microfabrication . Its primary use is in etching thin film s of silicon dioxide SiO sub 2 sub or silicon nitride Si sub 3 sub N sub 4 sub . It is a mixture of a buffering agent , such as ammonium fluoride NH sub 4 sub F , and hydrofluoric acid HF . Concentrated HF typically 49 water etches silicon dioxide too quickly for good process control. Buffered oxide etch is commonly used for more controllable etching. ref name Wolf cite book title Silicon Processing for the VLSI Era Volume 1 Process Technology last Wolf first S. coauthors R.N. Tauber year 1986 pages 532 533 isbn 0 961672 3 7 ref Some oxides produce insoluble products in HF solutions. Thus, HCl is often added to BHF solutions in order to dissolve these insoluble products and produce a higher quality etch. ref name Iliescua2005 cite journal doi 10.1016 j.surfcoat.2004.10.094 year 2005 month Aug author Iliescua, Ciprian title Characterization of masking layers for deep wet etching of glass in an improved HF HCl solution volume 198 issue 1 3 pages 314 journal J. Surf. Coat. last2 Jing first2 J last3 Tay first3 F last4 Miao first4 J last5 Sun first5 T ref A common buffered oxide etch solution comprises a 6 1 volume ratio of 40 NH sub 4 sub F in water to 49 HF in water. This solution will etch thermally grown oxide at approximately 2 nanometres per second at 25 degrees Celsius. ref name Wolf References reflist Category Etching microfabrication fr Buffered oxide etch ... more details
Taxobox color violet name Tobacco etch virus TEV image image caption Tobacco etch virus on jimsonweed. virus group iv familia Potyviridae genus Potyvirus species Tobacco etch virus synonyms datura Z virus br tobacco severe etch virus br tomato etch virus Tobacco etch virus TEV is a plant pathogenic virus ref http www.doacs.state.fl.us pi enpp pathology florida viruses What 20is 20a 20virus aboutv.html About Plant Viruses ref in the genus Potyvirus and the virus family Potyviridae . Like other members of the Potyvirus genus, TEV is a monopartite strand of positive sense, single stranded RNA surrounded by a capsid made for a single viral encoded protein. The virus is a filamentous particle that measures about 730 nm in length. It is transmissible in a non persistent manner by more than 10 species of aphids including Myzus persicae . It also is easily transmitted by mechanical means but is not known to be transmitted by seeds. ref http www.dpvweb.net dpv showdpv.php?dpvno 258 ref Host Range This virus infects many species of Solanaceae . Agriculturally important crops that it infects include several species of Capsicum i.e. C. annuum , C. frutescens , tomato Lycopersicon esculentum , and tobacco Nicotiana spp. . It also infects many perennial weed species that can act as virus reservoirs for susceptible agricultural crops. These weed species include Solanum nigrum nightshade , S. aculeatissimum soda apple , Chenopodium album pigweed , Datura stramonium jimson weed , Linaria ... TEVinc.html Inclusions of Tobacco etch virus in various hosts . Geographic Distribution TEV ... LC pepper TEV.pdf Tobacco Etch Virus Pepper Diseases http www.avrdc.org pdf tomato TEV.pdf Tobacco Etch Virus Tomato Diseases http www.acdiainc.com TEV.htm Tobacco Etch Virus DAS ELISA http phene.cpmc.columbia.edu ICTVdB 00.057.0.01.067.htm ICTVdB The Universal Virus Database Tobacco etch virus ... dpv showdpv.php?dpvno 258 Descriptions of Plant Viruses DPV DEFAULTSORT Tobacco Etch Virus ... more details
Summary Information Description Microstructure of thermally etched 99.9 Al2O3 translucent ceramic in reflected light. Source self made Date 22 08, 8 January 2008 UTC Author User His Manliness His Manliness User talk His Manliness talk Permission none required. other versions none. Licensing self GFDL cc by 3.0 Copy to Wikimedia Commons bot Fbot priority true ... more details
Beschreibung Screenshot of Debian s Iceweasel on Debian GNU Linux 4.0 showing the about page. Licensing self GFDL cc by sa 2.5,2.0,1.0 migration relicense Orphan image Copy to Wikimedia Commons bot Fbot ... more details
Summary Etch A Sketch with most of the aluminum powder removed, showing stylus, mechanisms, and styrene beads. Licensing GFDL self with disclaimers migration relicense Copy to Wikimedia Commons bot Fbot priority true ... more details
2011 ref . Its products include etch system s, including dielectric etch products, conductor etch products ... 2004 Launched 2300 Versys Kiyo silicon etch system extending advanced tuning capabilities for 65 ... processes on 2300 Exelan Flex dielectric etch system Achieved ISO 14001 environmental management system registration 2002 Launched 2300 Versys Star silicon etch system for sub 90 nm applications ... technical information and documentation online 2001 Introduced the TCP 9600DFM metal etch system ... wafer fabrication process equipment 2000 Shipped 2,000th high density TCP etch chamber Launched 2300 Etch Series, offering 200mm and 300mm capability 1999 Shipped 100th Synergy Integra integrated CMP cleaning system Introduced next generation Exelan dielectric etch system employing Dual ... 9 August 2011 ref 1996 Shipped 500th TCP Etch Series chamber Introduced improved DFC technology, 4520XLE dielectric etch system 1995 Introduced first product incorporating DFC technology, 4520XL dielectric etch system Achieved 0.25 micrometre process capabilities in all served markets 1994 Opened R&D ... Plasma source technology based products, the TCP 9400 for silicon etch and the TCP 9600 for metal etch 1990 Established presence in China 1987 Relocated to new headquarters on Cushing Parkway in Fremont Introduced Rainbow 4400 Etch Series successor to AutoEtch for polysilicon etch 1985 Established a global presence Asia and Europe Introduced first oxide etch system, the AutoEtch 590 1984 Achieved IPO and listing on Nasdaq 1981 Introduced first product, the AutoEtch 480, for polysilicon etch ... more details
HARMST is an acronym for H igh A spect R atio M icrostructure T echnology that describes fabrication technologies, used to create high aspect ratio aspect ratio microstructures with heights between tens of micrometers up to a centimeter and aspect ratio aspect ratios greater than 10 1. Examples include the LIGA fabrication process, Advanced Silicon Etch advanced silicon etch , and deep reactive ion etching . See also LIGA Advanced Silicon Etch Deep Reactive Ion Etching Microelectromechanical systems High aspect ratio .28HAR.29 silicon micromachining Micromechanical Systems High Aspect Ratio HAR Micromachining External links http www.mancef.org node 56 The International LIGA interest group Category Materials science Category Microtechnology engineering stub ... more details
Unreferenced stub auto yes date December 2009 Orphan date December 2009 Polycide is a silicide formed over polysilicon . Widely used in DRAM s. In a polycide MOSFET transistor process, the silicide is formed only over the polysilicon film as formation occurs prior to any polysilicon etch. Polycide processes contrast with salicide processes in which silicide is formed after the polysilicon etch. Thus, with a salicide process, silicide is formed over both the polysilicon gate and the exposed monocrystalline terminal regions of the transistor in a self aligned gate self aligned fashion. Chemistry stub Category Semiconductor device fabrication Category Silicon it Saliciuro ... more details
wiktionary etching Etching may refer to Etching , a printmaking technique in art Etching glass , a glass decoration technique Etching metal , a metal decoration technique Industrial etching Etching microfabrication , a process in producing microelectronics Note that all of the above can be called chemical etching , though the term is mostly used for industrial etching. An etcher is most likely to mean a printmaker. An etchant sometimes mordant is any chemical used to etch, but probably refers to an industrial process. See also Etch disambiguation disambig sv Etsning ru de tzen eo Mordado es Fresado qu mico fr Gravure industrielle pt Fresagem qu mica sv Etsning kemi uk ... more details
Summary Information Description Etch Photo of Monserrate Castle in Portugal. Made by using modern photorealistic etching techniques. Photo was taken by Nathaniel Nguyen while he was living in Portugal. The etch photo was made by using modern techniques while using intaglio relief standard technqiues. Printed on gold leaf. Source Nathaniel Nguyen Date April, 2007 Location Portugal, Near Sintra Author User Ndraven Ndraven User talk Ndraven talk Nathaniel Nguyen Permission to copy, distribute and transmit the work while attributing the work to Nathaniel Nguyen other versions Licensing self cc by 3.0 Copy to Wikimedia Commons bot Fbot priority true ... more details
the radial etch rate ref cite journal author P.Y.Apel, I.V. Blonskaya, A.Y. Didyk, S.N. Dmitriev ... of track etch pore morphology journal Nuclear Instruments and Methods in Physics Research Nuclear ... 2 sub SO sub 4 sub 80 Fast 10 100 sup 1 sup Sensitizer increase track etch ratio. br sup 2 sup Desensitizer decrease track etch ratio. br sup 3 sup Typical etch temperature. br sup 4 sup General etch speed v sub g sub . br sup 5 sup Selectivity aspect ratio, track etch ratio track etch speed general etch speed v sub t sub v sub g sub . br sup 6 sup Method requires the removal of metal oxides by aqueous ... more details
. The key to developing successful complex etching processes is to find the appropriate gas etch chemistry ... date December 2008 External links http www.clarycon.com plasmaetchfundam.html Plasma Etch Fundamentals ... more details
taxobox image regnum Plantae unranked divisio Angiosperms unranked classis Monocots unranked ordo Commelinids ordo Poales familia Bromeliaceae genus Neoregelia species N. pascoaliana binomial Neoregelia pascoaliana binomial authority L.B. Smith Neoregelia pascoaliana is a species biology species of the genus biology genus Neoregelia . This is a species that is Endemism endemic to Brazil . Cultivars Neoregelia Etch a Sketch Neoregelia Etch a Sketch References http www.bsi.org brom info cultivar bcr.html BSI Cultivar Registry Retrieved 11 October 2009 http www.dpi.inpe.br referata arq 22 Rafael Bromelias Bromelia Mata Atlantica.pdf BROMELIACEAE DA MATA ATL NTICA BRASILEIRA retrieved 22 October 2009 Category Flora of Brazil Category Neoregelia pascoaliana Category Bromeliaceae species neoregelia stub ... more details
TEV may refer to TeV , or teraelectronvolt, a measure of energy Enterprise value Total Enterprise Value , a financial measure Total Economic Value , an economic measure Tobacco etch virus , a plant pathogenic virus of the family Potyviridae . Today s English Version, a former name for the Good News Bible TEV, a ship prefix for Turbo electric ship Vessel , usually with steam driven turbine s. Thermal expansion valve , a refrigeration system component disambig de TEV eo TEV it TEV no TEV ... more details
Unreferenced date August 2009 dablink For the railroad, see Kelowna Pacific Railway . dablink For the Kenyan police unit, see Kenya Police Reserve . KPR , originally known as Kodak Photoresist, is a photosensitive material used in photoengraving , Photogravure and photolithography . Once dried KPR can be dissolved by several solvents but after exposure to strong ultraviolet light it hardens and becomes insoluble by some of these solvents. It is also resistant to acid , Iron III chloride ferric chloride and other chemicals used to etch metals. Category Kodak photo stub ... more details
A hardmask is a material used in semiconductor processing as an etch mask in lieu of polymer or other organic soft resist materials. The idea is that polymers tend to be etched easily by oxygen , fluorine , chlorine or other reactive gases to the extent that a pattern defined using polymeric mask is rapidly degraded during plasma etching . material stub Category Semiconductor device fabrication ... more details
Screenshot of how bold and bold italic text look in my browser Firefox well, Iceweasel 2.0.0.6 running on Debian etch GNU Linux under KDE 3.5.5 at 92 , 95 and 100 font sizes, for discussion at Template talk Db meta . The font is FreeSans, default size 16. Licensing Wikipedia screenshot Copy to Wikimedia Commons bot Fbot Orphan image ... more details
unsourced date April 2009 Bulk micromachining is a process used to produce micromachinery or microelectromechanical systems MEMS . Unlike surface micromachining , which uses a succession of thin film deposition and selective etching, bulk micromachining defines structures by selectively etching inside a substrate. Whereas surface micromachining creates structures on top of a substrate, bulk micromachining produces structures inside a substrate. Usually, silicon Wafer electronics wafer s are used as substrates for bulk micromachining, as they can be anisotropic ally wet etched, forming highly regular structures. Wet etching typically uses alkaline liquid solvent s, such as potassium hydroxide KOH or tetramethylammonium hydroxide TMAH to dissolve silicon which has been left exposed by the photolithography masking step. These alkali solvents dissolve the silicon in a highly anisotropic way, with some crystallographic orientations dissolving up to 1000 times faster than others. Such an approach is often used with very specific crystallographic orientations in the raw silicon to produce V shaped grooves. The surface of these grooves can be atomically smooth if the etch is carried out correctly, and the dimensions and angles can be precisely defined. Bulk micromachining starts with a silicon wafer or other substrates which is selectively etched, using photolithography to transfer a pattern from a mask to the surface. Like surface micromachining, bulk micromachining can be performed with wet or dry etches, although the most common etch in silicon is the anisotropic wet etch. This etch takes advantage of the fact that silicon has a crystal structure, which means its atoms are all arranged periodically in lines and planes. Certain planes have weaker bonds and are more susceptible to etching. The etch results in pits that have angled walls, with the angle being a function of the crystal orientation of the substrate. This type of etching is inexpensive and is generally used in ... more details
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